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bonding

  • Product information
  • Technical parameter
1. APG material has the rotating target setting technology with independent core advantages. This technology not only uses less indium, but also has high setting strength and better conductivity and thermal conductivity of the target, so as to solve the problems of miss and crack in the use of the target.
2. The target produced with this help technology can meet the requirements of high-power sputtering. Our azo rotating target promises sputtering power > 15kw / m
3. Advanced setting technology can effectively reduce the use of indium and make it possible to reduce the cost of the target.
4. Design and produce waterway copper backplane for customers and provide help service.

1. It can bonding plane target and rotating target
2. Bonding gap > 98%
3. C-scan ultrasonic inspecting and issue the inspecting report.