Copper (Cu) is a high-conductivity, thermally efficient transition metal essential for advanced thin-film applications. Typically supplied as high-purity ingots, pellets, or chunks, copper is optimized for vacuum deposition, electron-beam (e-beam) evaporation, and magnetron sputtering. The resulting thin films are characterized by high density, homogeneity, and superior interfacial adhesion, significantly optimizing the electrical, thermal, and structural stability of integrated devices.

Outstanding Properties of Copper

• High Purity

  Purity up to 99.9%–99.99%, with low impurity content, ensuring stable and reliable film performance.

• Excellent Conductivity

  High electrical conductivity, making it suitable for the production of conductive films, electrodes, and interconnect layers.

• Good Thermal Conductivity

  High thermal conductivity, ideal for electronic device films requiring heat dissipation.

• Excellent Ductility

  Forms uniform, dense films on various substrates with strong adhesion.

Widespread Applications of Copper

1. Semiconductor Manufacturing

   Used as interconnect layers, conductive films, electrodes, and contact layers, widely applied in chip, circuit board, and packaging processes.

2. Optical Device Manufacturing

   Used in reflective films, optical filters, and functional coatings to enhance optical performance.

3. Photovoltaic Industry

   Applied in functional films in solar cells, lithium batteries, and fuel cells to improve energy efficiency and stability.

4. Decorative and Protective Coatings

   Used in consumer electronics housings, architectural decorations, and crafts to form coatings that are both decorative and protective.