Inductor Core Paste

APG

Pastes

Inductor Core Paste

High Magnetic Permeability
Low Magnetic Loss
Excellent Flowability and Fillability
Good Thermal Stability

Product Introduction

Inductor core paste is a high-performance functional medium formulated from soft magnetic alloys (such as Fe-based amorphous powders), specialized epoxy resins, and active diluents. Engineered for filling or precision printing, the material achieves high magnetic permeability and minimal core loss upon curing. Its robust magnetic profile is specifically optimized for high-frequency and elevated-temperature operational environments.

Core Advantages

●  High Heat Resistance

Glass transition temperature >150°C, with some products capable of withstanding temperatures up to 200°C, ensuring stability in high-temperature environments.

●  High Fillability and Flowability

Optimized alloy powder grading with multiple particle sizes, achieving high solid content filling, avoiding cracking or void formation during curing.

●  Process-Friendly

Viscosity is adjustable, suitable for filling PCB vias or embedded forming on substrates, simplifying the integration process.

Application Areas

This material is primarily utilized in the fabrication of Fully Integrated Voltage Regulators (FIVR), planar inductors, and embedded magnetic substrates. It serves as a critical technology enabler for high-performance power electronics in AI servers, hyperscale data centers, and Next-Generation Vehicle (NGV) power modules.

Technical Specifications

Technical Characteristics

  • Solid Content (wt%):

    Solid Content (wt%):

    70~75

  • Viscosity (Pa·S):

    Viscosity (Pa·S):

    60±20

  • Fineness (90%):

    Fineness (90%):

    ≤7.5μm

Application Fields

  • Magnetic Bead

    Magnetic Bead

  • Multi-layer Chip Inductors

    Multi-layer Chip Inductors

  • High-Frequency Inductor

    High-Frequency Inductor

  • Common Mode Inductor

    Common Mode Inductor

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