Silver termination paste is a foundational material for the formation of external inductor electrodes. Formulated from high-purity silver powder, glass frit, and a specialized organic vehicle, it is applied via precision dipping or screen-printing methodologies. Following low-temperature sintering, it develops a highly densified electrode layer that ensures a robust interface between internal coils and external circuitry, providing the necessary resilience for subsequent Ni/Sn electroplating processes.

Core Advantages

●  High Conductivity

High silver content (typically 80%-90%) with conductivity up to 10⁵ S/cm or higher, ensuring low resistance and minimal signal loss.

●  Fine Printing Adaptability

The paste's fineness can be controlled to ≤8μm, supporting 30μm-level line printing, meeting the high-precision multi-layer structure requirements.

●  Excellent Co-firing Compatibility

Matches the shrinkage rate of ferrite dielectric materials, avoiding cracking or delamination during sintering and enhancing product reliability.

●  Environmentally Friendly and Safe

Complies with lead-free and cadmium-free environmental standards, suitable for export electronic products.

Application Areas

Mainly used for the internal electrode manufacturing of multi-layer chip inductors (MLCI), high-frequency inductors, and magnetic beads. It is widely applied in signal processing and power conversion modules in high-frequency circuits such as smartphones, communication base stations, and automotive electronics.

Technical Specifications