Silver termination paste is a foundational material for the formation of external inductor electrodes. Formulated from high-purity silver powder, glass frit, and a specialized organic vehicle, it is applied via precision dipping or screen-printing methodologies. Following low-temperature sintering, it develops a highly densified electrode layer that ensures a robust interface between internal coils and external circuitry, providing the necessary resilience for subsequent Ni/Sn electroplating processes.

Core Advantages

●  Strong Adhesion

The use of composite flake glass powder technology promotes the sinking of the glass phase and the embedding of the silver layer after sintering, significantly enhancing the bonding strength between the electrode and the magnetic core.

● Excellent Solderability

The electrode layer is dense and smooth, with good compatibility with nickel/tin plating processes, ensuring the reliability of SMT mounting.

●  Low Cost and Environmental Friendliness

By optimizing the silver powder particle size ratio (e.g., combining micron/submicron silver powders), high performance can be maintained with silver content below 60%, supporting a "no-plating" process that reduces electroplating pollution.

●  Process Adaptability

Viscosity is controllable (e.g., 39±6 Pa·s), suitable for various coating methods such as dipping and screen printing.

Application Areas

Specifically used for forming end electrodes in chip inductors, magnetic beads, and LTCC modules, it is a key material for the termination of chip components in consumer electronics, networking devices, and automotive electronics.